Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

A substrate processing apparatus, comprising:

• a process chamber in which at least one substrate is processed;
• an electromagnetic wave supply part installed on a first side surface of the process chamber, and configured to supply an electromagnetic wave to the at least one substrate;
• a substrate holding part installed inside the process chamber, and configured to hold the at least one substrate and at least one susceptor for suppressing the electromagnetic wave from being adsorbed to an edge of the at least one substrate;
• a substrate loading/unloading port installed on a second side surface of the process chamber, which faces the electromagnetic wave supply part, and capable of loading and unloading the at least one substrate into and from the process chamber;
• a cooling chamber configured to cool the at least one substrate unloaded from the process chamber after the at least one substrate is processed inside the process chamber
• a substrate transfer part comprising:
• a high-temperature substrate transfer part configured to transfer an unprocessed substrate from a pod to the process chamber, transfer a processed substrate from the process chamber to the cooling chamber, and transfer a cooled substrate from the cooling chamber to the pod;
• and
• a low-temperature substrate transfer part configured to transfer an unprocessed substrate from the pod to the process chamber, and transfer a cooled substrate from the cooling chamber to the pod;
• and
• a controller configured to control the high-temperature substrate transfer part so as to correct a position of the at least one susceptor through the substrate loading/unloading port;
• wherein the controller controls the substrate transfer part so as to correct the position of the at least one susceptor by the high-temperature substrate transfer part after an irradiation time of the electromagnetic wave has elapsed a predetermined period of time;
• and
• wherein the substrate transfer part is configured to correct the position of the at least one susceptor by sandwiching an edge portion of the at least one susceptor with grips of the high-temperature substrate transfer part.