Integrated fan-out package and manufacturing method thereof

An integrated fan-out package, comprising:

• a first redistribution structure, comprising:
• a first dielectric layer;
• a signal enhancement layer aside the first dielectric layer, wherein the signal enhancement layer has a lower dissipation factor (Df) and/or a lower permittivity (Dk) than the first dielectric layer;
• and
• a first feed line aside the first dielectric layer, wherein the signal enhancement layer laterally wraps around the first feed line;
• a die, disposed on the first redistribution structure;
• an insulation encapsulation encapsulating the die;
• and
• at least one first through interlayer via (TIV) laterally wrapped around by the insulation encapsulation and the signal enhancement layer.

A manufacturing method of an integrated fan-out package, comprising:

• forming a first redistribution structure, comprising:
• forming a first dielectric layer;
• and
• forming a first feed line on the first dielectric layer;
• placing a die on the first redistribution structure, wherein the die has an active surface and a rear surface opposite to the active surface, and the rear surface of the die is attached to the first redistribution structure;
• forming at least one first through interlayer via (TIV) on the first redistribution structure;
• forming a first signal enhancement layer covering the first feed line and laterally wrapping around the at least one first TIV, wherein the first signal enhancement layer has a lower dissipation factor (Df) and/or a lower permittivity (Dk) than the first dielectric layer;
• and
• forming an insulation encapsulation on the first redistribution structure to encapsulate the die and laterally wrap around the at least one first TIV.