Data storage for accelerating functions

An integrated circuit package comprising:

• a package substrate;
• an interposer coupled to the package substrate, wherein the interposer comprises a memory integrated circuit die that is embedded in the interposer;
• and
• a coprocessor integrated circuit die coupled to the interposer and to the memory integrated circuit die, wherein the coprocessor integrated circuit die comprises a logic sector, wherein the memory integrated circuit die stores configuration data for configuring the logic sector to accelerate a function for a host processor, wherein the logic sector generates an intermediate result of a computation performed as part of the function, and wherein the intermediate result is transmitted to and stored in the memory integrated circuit die without the intermediate result being transmitted through a processor circuit,
• wherein a secure device manager in the coprocessor integrated circuit die communicates with a local sector manager at the logic sector to determine whether the logic sector is configured to carry out the function, and wherein if the secure device manager determines that the logic sector is not configured to perform the function, the host processor provides the local sector manager with a pointer to a location of the configuration data in the memory integrated circuit die for performing the function, the configuration data is retrieved from the memory integrated circuit die, and the logic sector is configured with the retrieved configuration data to perform the function.

A method for storing data in a memory integrated circuit die, the method comprising:

• communicating with a local sector manager at a logic sector that is part of a coprocessor integrated circuit die to determine whether the logic sector is configured to perform a function using a secure device manager in the coprocessor integrated circuit die;
• if the secure device manager determines that the logic sector is not configured to perform the function, providing the local sector manager with a pointer to a location of configuration data stored in the memory integrated circuit die for performing the function, retrieving the configuration data from the memory integrated circuit die, and configuring the logic sector with the retrieved configuration data to perform the function;
• generating an intermediate result of a computation that is performed as part of the function being accelerated for a host processor with the logic sector;
• transmitting the intermediate result from the coprocessor integrated circuit die to the memory integrated circuit die through first conductive bumps without the intermediate result being transmitted through a processor circuit, wherein the memory integrated circuit die and the coprocessor integrated circuit die are coupled together through the first conductive bumps within an integrated circuit package;
• storing the intermediate result in the memory integrated circuit die;
• transmitting the intermediate result from the memory integrated circuit die through the first conductive bumps to the coprocessor integrated circuit die in response to a request from the logic sector without the intermediate result being transmitted through a processor circuit;
• and
• performing an additional part of the computation for the function with the logic sector using the intermediate result received from the memory integrated circuit die.