Substrate perforation system and method using polygon mirror(s)

A method for creating a perforation in a substrate, comprising:

• directing a laser beam from a laser;
• rotating a first polygon mirror comprising a plurality of faces that are disposed on a perimeter of said first polygon mirror;
• reflecting said laser beam from a face of said plurality of faces;
• removing material from a substrate, after said reflecting step, by impacting said laser beam on said substrate;
• repeating said reflecting and removing steps a plurality of times to define a first perforation in said substrate;
• defining a first plurality of perforations on said substrate using said repeating step, wherein each perforation of said first plurality of perforations is spaced from a remainder of said first plurality of perforations, and wherein said first plurality of perforations comprises said first perforation;
• wherein an optical system comprises said first polygon mirror and said laser, wherein said optical system is in a first position for said defining a first plurality of perforations step, said method further comprising:
• moving an entirety of said optical system from said first position to a second position;
• and
• defining a second plurality of perforations on said substrate using said repeating step, wherein each perforation of said second plurality of perforations is spaced from a remainder of said second plurality of perforations, wherein said first plurality of perforations and said second plurality of perforations are defined in non-overlapping portions of said substrate, and wherein said optical system is in said second position for said defining a second plurality of perforations step.