TSV testing method and apparatus
AssigneeTexas Instruments Incorporated
InventorLee D. Whetsel
Life of this patent
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Abstract
An integrated circuit die includes a substrate of semiconductor material having a top surface, a bottom surface, and an opening through the substrate between the top surface and the bottom surface. A through silicon via (TSV) has a conductive body in the opening, has a top contact point coupled to the body at the top surface, and has a bottom contact point coupled to the body at the bottom surface. A scan cell has a serial input, a serial output, control inputs, a voltage reference input, a response input coupled to one of the contact points, and a stimulus output coupled to the other one of the contact points.
Claims15
An integrated circuit die having a top surface and a bottom surface, comprising:
- (a) a first top contact on the top surface and a first bottom contact on the bottom surface;
- (b) a first through silicon via in the die having a first top end coupled to the first top contact and a first bottom end coupled to the first bottom contact;
- (c) a first scan cell having a first reference voltage input, a first serial data input, a first serial data output, a first control input, a first stimulus output coupled to one of the first top end and the first bottom end of the first through silicon via, and a first response input coupled to the other of the first top end and the first bottom end of the first through silicon via;
- (d) a second top contact on the top surface and a second bottom contact on the bottom surface;
- (e) a second through silicon via in the die having a second top end coupled to the second top contact and a second bottom end coupled to the second bottom contact;
- and
- (f) a second scan cell having a second reference voltage input, a second serial data input, a second serial data output, a second control input, a second stimulus output coupled to one of the second top end and the second bottom end of the second through silicon via, and a second response input coupled to the other of the second top end and the second bottom end of the second through silicon via, wherein the first serial data output of the first scan cell is coupled to the second serial data input of the second scan cell.
Dependencies are inferred from the claim text.