Comolded non-destructive inspection standard functioning as a bond bump
AssigneeRaytheon Technologies Corporation
InventorsDavid R. Lyders, Andrew Pope, Christopher Avery, Daniel A. Rodrigues
Life of this patent
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Abstract
An inspection feature for an adhesive bond portion between parts of a component comprising the inspection feature extending from a surface of the part of the component a predetermined bond line thickness, the inspection feature having a density configured to imitate a defect of the adhesive bond portion responsive to a non-destructive inspection scan.
Claims20
An inspection feature for an adhesive bond portion between parts of a component comprising:
- said inspection feature extending from a surface of the part of the component a predetermined bond line thickness, said inspection feature having a density configured to imitate a defect of the adhesive bond portion responsive to a non-destructive inspection scan.
A component having parts bonded together by an adhesive bond portion comprising:
- a first part attachable to a second part;
- a bond line thickness defined by the adhesive bond portion coupling said first part to said second part;
- an inspection feature extending a predetermined bond line thickness from a surface of at least one of the first part and the second part, said inspection feature having a density configured to imitate a defect of the adhesive bond portion responsive to a non-destructive inspection scan.
A process for use of an inspection feature for an adhesive bond portion between a first part and a second part of a component comprising:
- forming an inspection feature extending a predetermined bond line thickness from a surface of at least one of the first part and the second part,
- forming the adhesive bond portion coupling said first part to said second part to form the component;
- scanning said inspection feature and said adhesive bond portion with a non-destructive inspection scan;
- and
- creating an image from the non-destructive inspection scan, wherein said inspection feature comprises a density configured to imitate a defect within the adhesive bond portion responsive to the non-destructive inspection scan.
Dependencies are inferred from the claim text.