Method of processing substrate

A method of processing each of a plurality of substrates by supplying a carrier gas having a flow rate adjusted by a mass flow controller to a raw material container, and supplying a vaporized raw material obtained by vaporizing a solid or liquid raw material inside the raw material container together with the carrier gas as a raw material gas to a substrate processing part via a raw material gas supply path in which a mass flow meter is installed, the method comprising:

• supplying the carrier gas to the raw material container and obtaining a first correction factor based on a first flow rate set value of the mass flow controller and a first measurement value of the mass flow meter, wherein the mass flow controller adjusts the flow rate of the carrier gas to be the first flow rate set value, the first measurement value of the mass flow meter corresponds to a flow rate of the raw material gas containing at least the carrier gas and the vaporized raw material, and the first correction factor is a ratio of a flow rate of the vaporized raw material to the flow rate of the carrier gas;
• adjusting the first flow rate set value of the mass flow controller according to the first correction factor so that the flow rate of the vaporized raw material becomes equal to a target value to process the substrate;
• after the step of obtaining the first correction factor, supplying the carrier gas to the raw material container and obtaining a second correction factor based on a second flow rate set value of the mass flow controller and a second measurement value of the mass flow meter, wherein the mass flow controller adjusts the flow rate of the carrier gas to be the second flow rate set value, the second measurement value of the mass flow meter corresponds to the flow rate of the raw material gas containing at least the carrier gas and the vaporized raw material, and the second correction factor is a ratio of the flow rate of the vaporized raw material to the flow rate of the carrier gas;
• and
• adjusting the second flow rate set value of the mass flow controller according to the second correction factor so that the flow rate of the vaporized raw material becomes equal to the target value to process the substrate.