Cleaning method

A cleaning method for a component of a plasma processing apparatus, the method comprising:

• a step of removing a reaction product formed on a peripheral side part of an electrostatic chuck of a loading table which is disposed in the plasma processing apparatus and on which a workpiece is loaded, wherein
• the loading table includes a heat exchange unit that is disposed in the plasma processing apparatus and exchanges heat using a refrigerant,
• the step of removing the reaction product includes
• a step of loading a dummy wafer on the loading table,
• a step of increasing a temperature of the loading table by
• having open an expansion valve, disposed between an output terminal of a condenser, which condenses the refrigerant that is discharged from the heat exchange unit and compressed and supplies the refrigerant to the heat exchange unit, and an input terminal of the heat exchange unit,
• inputting heat to the loading table,
• opening a flow dividing valve between an output terminal of a compressor, which compresses the refrigerant discharged from the heat exchange unit and supplies the refrigerant to the condenser, and the input terminal of the heat exchange unit, and
• adjusting an opening degree of the flow dividing valve, and
• a step of introducing a gas mixture to remove the reaction product after increasing the temperature of the loading table, wherein
• in response to a time period elapsing, the heat to the loading table is stopped at the same time that the flow dividing valve is closed, and
• the expansion valve is held open at a constant value throughout the entire step of removing the reaction product while the opening degree of the flow dividing valve is adjusted during the step of removing the reaction product.