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US 11,236,259 B2Granted
Thermally conductive composition
AssigneeSekisui Polymatech Co., Ltd.
InventorsGaku Kitada, Keita Ishida
Life of this patent
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Abstract
The thermally conductive composition comprises a thermally conductive filler dispersed in a liquid matrix.
Claims8
A thermally conductive composition comprising a thermally conductive filler dispersed in a liquid matrix, wherein
- a volume-based median diameter of the thermally conductive filler is 0.5 to 100 μm;
- a content of the thermally conductive filler in the thermally conductive composition is 50 to 95 vol %;
- the thermally conductive filler comprises a first thermally conductive filler having a Mohs hardness of 3 or more and a second thermally conductive filler having a Mohs hardness of less than 3;
- in the first thermally conductive filler in the thermally conductive composition, a content of the first thermally conductive filler that has a Mohs hardness of 4 or more and a particle diameter of 10 μm or more is 1 to 3 vol % based on the whole thermally conductive filler;
- in the first thermally conductive filler in the thermally conductive composition, a content of the first thermally conductive filler that has a Mohs hardness of 3 or more and a particle diameter of 30 μm or more is 1 to 3 vol % based on the whole thermally conductive filler;
- the viscosity of the thermally conductive composition at 25° C. is in the range of 10 to 600 Pa·s;
- and
- the volume based mixing ratio of the first thermally conductive filler to the second thermally conductive filler (first thermally conductive filler/second thermally conductive filler) is 0.3 to 0.9.
5 more elements
Dependencies are inferred from the claim text.