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US 11,236,249 B2Granted
Method of manufacturing a conductive pattern
AssigneeAgfa-Gevaert
InventorsFernando Cortes Salazar, Koen Steert, Vincent Courtet, Karl Van Den Bossche, Willem Gilbert, Gert Daelemans, Peter Willaert
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Abstract
A method of preparing a conductive pattern on a substrate includes the steps of applying a receiving layer on a substrate, applying a metallic nanoparticle dispersion on the white receiving layer thereby forming a metallic pattern, and sintering the metallic pattern, characterized in that the receiving layer has a roughness Rz between 1 and 75.
Claims16
A method of preparing a conductive pattern on a substrate for making a touch panel device, the method comprising:
- applying a receiving layer on a substrate;
- applying a metallic nanoparticle dispersion directly on at least a portion of the receiving layer to define a metallic pattern;
- and
- sintering the metallic pattern;
- wherein
- the receiving layer has a roughness Rz between 15 μm and 75 μm.
3 more elements
Dependencies are inferred from the claim text.