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US 11,236,227 B2Granted
Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same
AssigneeTatsuta Electric Wire & Cable Co., Ltd.
InventorsHiroaki Umeda, Kazuhiro Matsuda, Ken Yukawa
Life of this patent
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Abstract
Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. A heat dissipation material having adhesive is obtained by coating a portion or the whole of the heat dissipation material with a heat dissipation material adhering composition including a resin component containing an epoxy resin, a curing agent, and an inorganic filler, and having a complex viscosity at 80° C. of 1×103 Pa·s to 5×106 Pa·s.
Claims11
A heat dissipation material adhering composition comprising:
- a resin component containing an epoxy resin;
- a curing agent;
- and
- an inorganic filler component that consists of at least one selected from the group consisting of gold powder, silver powder, copper powder, nickel powder, powder of alloy, silver coated copper powder, gold coated copper powder, silver coated nickel powder, gold coated nickel powder, graphene, carbon, and a combination thereof, the powder of alloy comprising two or more metals selected from gold, silver, copper, and nickel,
- wherein the heat dissipation material adhering composition is devoid of other inorganic fillers,
- wherein a content of the inorganic filler component is from 20% to 65% by volume based on a total amount of the resin component, the curing agent, and the inorganic filler component, and
- wherein the heat dissipation material adhering composition has a complex viscosity at 80° C. of from 1×105 Pa·s to 5×106 Pa·s.
4 more elements
Dependencies are inferred from the claim text.