Thermal conductive silicone composition, semiconductor device, and method for manufacturing semiconductor device

A thermal conductive silicone composition comprising:

• (A) an organopolysiloxane having a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and represented by the following average composition formula (1)
• R1aSiO(4-a)/2 (1)
• wherein R1 represents a hydrogen atom, a hydroxy group or a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms, and a represents a number satisfying 1.8≤a≤2.2;
• (B) silver nanoparticles having an average particle size of 3 to 600 nm, the silver nanoparticles being in an amount of 50 to 1,700 parts by mass per 100 parts by mass of the component (A);
• (C) a thermal conductive filler other than the component (B), having an average particle size of 0.7 to 100 μm and a thermal conductivity of 10 W/m° C. or higher, the thermal conductive filler being in an amount of 50 to 3,000 parts by mass per 100 parts by mass of the component (A);
• (D) a catalyst selected from the group consisting of a platinum based catalyst, an organic peroxide and a catalyst for condensation reaction, the catalyst (D) being in a catalytic amount;
• and
• (G) an organosilane being in an amount of 0.1 to 20 parts by mass per 100 parts by mass of the component (A), and represented by the following average composition formula (2)
• R2bSi(OR3)4-b (2)
• wherein R2 represents at least one group selected from:
• a saturated or unsaturated monovalent hydrocarbon group that may have a substituent group(s) and has 1 to 18 carbon atoms;
• an epoxy group;
• an acryl group;
• and a methacryl group, R3 represents a monovalent hydrocarbon group having 1 to 18 carbon atoms, and b represents a number satisfying 1≤b≤3.