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US 11,235,901 B2Granted
Method of die cutting a label
AssigneeLux Global Label Company, LLC
InventorNeil Sellars
Life of this patent
Estimating the term…
Abstract
A die cutting method that cuts patterns in a label is provided. According an embodiment, a method adjusts temperature of a label sheet comprising a laminated layer and a liner layer. The method further separates the laminated layer from the liner layer prior to making the cuts on the laminated layer. The method further cuts one or more patterns on the laminated layer. The method further re-attaches, the laminated layer to the liner layer.
Claims7
A computer implemented method, comprising:
- adjusting, by a system, using a heater, a temperature of a label sheet comprising a laminated layer and a liner layer;
- separating, by the system, the laminated layer from the liner layer;
- cutting, by the system, one or more patterns on the laminated layer;
- and
- re-attaching, by the system, the laminated layer to the liner layer.
2 more elements
Dependencies are inferred from the claim text.