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US 11,233,313 B2Granted
Method for manufacturing rear cover, rear cover and electronic device having the same
AssigneeGuangdong Oppo Mobile Telecommunications Corp., Ltd.
InventorXiaobing Wang
Life of this patent
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Abstract
A method for manufacturing a rear cover is provided. A housing is provided. The housing has a metal layer and a plastic layer. The metal layer has a first surface and a second surface. The plastic layer is formed on the first surface. A slot is defined in the metal layer. The slot passes through the first surface and the second surface of the metal layer. An unshielded portion is formed in the slot. A rear cover and an electronic device having the rear cover are also provided.
Claims20
A rear cover, comprising,
- a housing having a metal layer and a plastic layer;
- the metal layer having a first surface and a second surface, the plastic layer being formed on the first surface;
- wherein the metal layer defines a slot therein, and the slot passes through the first surface and the second surface of the metal layer;
- wherein the housing comprises a flat portion and a sidewall extending from a periphery of the flat portion, the sidewall comprises a first portion and a second portion, the first portion and the second portion are coupled to opposite sides of the flat portion, and the slot extends from the first portion to the second portion;
- and
- an unshielded portion, disposed in the slot.
3 more elements
A rear cover, comprising,
- a housing having a metal layer and a plastic layer;
- the metal layer having a first surface and a second surface, the plastic layer being formed on the first surface;
- wherein the metal layer defines a slot therein, and the slot passes through the first surface and the second surface of the metal layer;
- and
- an unshielded portion being disposed in the slot, wherein the unshielded portion is associated with a color uniformity of the second surface.
2 more elements
A rear cover, comprising,
- a housing having a metal layer and a plastic layer;
- the metal layer having a first surface and a second surface, the plastic layer being formed on the first surface;
- wherein the metal layer defines a slot therein, and the slot passes through the first surface and the second surface of the metal layer;
- wherein the housing defines at least one through hole therein, wherein the at least one through hole is configured to accommodate components of an electronic device;
- and
- an unshielded portion, disposed in the slot.
3 more elements
Dependencies are inferred from the claim text.