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US 11,233,017 B2Granted
Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits
AssigneeTexas Instruments Incorporated
InventorsMichael Lee Dawson, Edward J. Pryor, III, Jeffrey L. Large, Mary Coles
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Abstract
An integrated circuit package includes a first conductive element that is fabricated as part of the integrated circuit package and a micro-wire having a first end coupled to the first conductive element. The micro-wire has been fabricated ex-situ and is of a metal having a diameter of 10 microns or less.
Claims7
An apparatus comprising:
- a multilayer structure including:
- a dielectric;
- a metal layer in the dielectric;
- and
- a first conductive element on or in the dielectric;
- and
- a preformed metal micro-wire having a first end coupled to the first conductive element, the preformed metal micro-wire having been fabricated before being coupled to the multilayer structure, and the preformed metal micro-wire having a diameter of 10 microns or less.
4 more elements
Dependencies are inferred from the claim text.