Display device, stretchable display panel and fabricating method thereof

A fabricating method of a stretchable display panel, comprising:

• forming a flexible substrate on a substrate, the flexible substrate having a plurality of island regions and bridge regions connecting adjacent island regions;
• forming a first outer protective layer on the bridge regions;
• forming a first inner protective layer on a surface of the first outer protective layer facing away from the flexible substrate;
• forming a conductive layer on a part of a surface of the first inner protective layer facing away from the flexible substrate;
• forming a second inner protective layer covering the conductive layer and the first inner protective layer;
• forming a second outer protective layer on a surface of the second inner protective layer facing away from the flexible substrate;
• forming a packaging layer on a surface of the second outer protective layer facing away from the flexible substrate;
• and
• peeling the flexible substrate from the substrate;
• wherein a Young's modulus of the first inner protective layer and the second inner protective layer are lower than that of the first outer protective layer and the second outer protective layer;
• and
• wherein a Young's modulus of the first outer protective layer and the second outer protective layer are lower than that of the packaging layer.

A display device, comprising a stretchable display panel which comprising:

• a flexible substrate and a plurality of pixel islands and island-to-island connections disposed on the flexible substrate, wherein the island-to-island connections are configured to connect adjacent pixel islands and the island-to-island connections comprise:
• a first outer protective layer disposed on the flexible substrate;
• a first inner protective layer disposed on a surface of the first outer protective layer facing away from the flexible substrate;
• a conductive layer disposed on a part of a surface of the first inner protective layer facing away from the flexible substrate;
• a second inner protective layer configured to cover the conductive layer and the first inner protective layer;
• a second outer protective layer disposed on a surface of the second inner protective layer facing away from the flexible substrate;
• and
• a packaging layer configured to cover the second outer protective layer;
• wherein a Young's modulus of the first inner protective layer and the second inner protective layer are lower than that of the first outer protective layer and the second outer protective layer;
• and
• wherein a Young's modulus of the first outer protective layer and the second outer protective layer are lower than that of the packaging layer.