Film type package comprising a plurality of test pads disposed on a plurality of margin areas and separated from a plurality of first connection pads by a cut line

A film type package comprising:

• a base film having a plurality of package areas arranged in a longitudinal direction of the base film, and a plurality of margin areas located between the plurality of package areas;
• a plurality of package units disposed on the plurality of package areas, respectively;
• and
• a plurality of test pads disposed on the plurality of margin areas, the plurality of test pads being adjacent to a first side of each of the plurality of package areas of the base film,
• wherein each of the plurality of package units comprises:
• a driver integrated circuit mounted in a corresponding package area of the plurality of package areas;
• a plurality of first connection pads disposed adjacent to the first side of the corresponding package area;
• a plurality of second connection pads disposed adjacent to a second side of the corresponding package area, the second side being opposite to the first side;
• a plurality of first signal lines disposed on the corresponding package area, and connecting the driver integrated circuit and the plurality of first connection pads;
• a plurality of second signal lines disposed on the corresponding package area, and connecting the driver integrated circuit and the plurality of second connection pads;
• and
• a plurality of test lines disposed on the corresponding package area and connecting the driver integrated circuit and the plurality of test pads, and
• wherein the plurality of test pads are separated from the plurality of first connection pads by a cut line.