Heat transfer through frame component of head-mounted device

A system comprising:

• a frame component of a head-mounted device (HMD) configured to secure the HMD to a head of a user, the frame component comprising therein (i) a first compartment, (ii) a second compartment, and (iii) a channel connecting the first compartment and the second compartment, wherein the frame component is configured to be positioned along a side of the head with the channel passing over an ear of the head;
• a battery disposed within the first compartment;
• a processor disposed within the second compartment;
• an eyepiece comprising a display;
• a hinge connecting the eyepiece to the second compartment of the frame component, wherein the hinge is thermally conductive and configured to thermally connect the eyepiece to the second compartment, wherein a rate of heat transfer through the hinge is greater than a threshold value when the hinge is in an open conformation that configures the frame component to be positioned along the side of the head, and wherein the rate of heat transfer through the hinge is smaller than the threshold value when the hinge is in a folded conformation that configures the frame component to be positioned for storage;
• and
• a heat pipe extending from the first compartment to the second compartment and configured to transfer heat from the processor and the eyepiece to the battery.

A device formed by a process comprising:

• providing a frame component of a head-mounted device (HMD) configured to secure the HMD to a head of a user;
• creating, within the frame component, (i) a first compartment, (ii) a second compartment, and (iii) a channel connecting the first compartment and the second compartment, wherein the frame component is configured to be positioned along a side of the head with the channel passing over an ear of the head, the first compartment disposed on a first side of the ear, and the second compartment disposed on a second side of the ear, and wherein the first compartment is configured to house therein a battery;
• providing an eyepiece comprising a thermally conductive subframe and one or more components thermally connected to the subframe;
• providing a processor within the second compartment;
• providing a heat pipe extending from the first compartment to the second compartment through the channel to transfer heat from the processor to the battery;
• and
• providing a hinge connecting the eyepiece to the second compartment of the frame component, wherein the hinge is thermally conductive and configured to transfer heat from the one or more components to the heat pipe, wherein a rate of heat transfer through the hinge is greater than a threshold value when the hinge is in an open conformation that configures the frame component to be positioned along the side of the head, and wherein the rate of heat transfer through the hinge is smaller than the threshold value when the hinge is in a folded conformation that configures the frame component to be positioned for storage.