Integrated photonic device with improved optical coupling
AssigneeSTMicroelectronics (Crolles 2) SAS
InventorsFrederic Boeuf, Charles Baudot
Life of this patent
Estimating the term…
Abstract
A three-dimensional photonic integrated structure includes a first semiconductor substrate and a second semiconductor substrate. The first substrate incorporates a first waveguide and the second semiconductor substrate incorporates a second waveguide. An intermediate region located between the two substrates is formed by a one dielectric layer. The second substrate further includes an optical coupler configured for receiving a light signal. The first substrate and dielectric layer form a reflective element located below and opposite the grating coupler in order to reflect at least one part of the light signal.
Claims12
A three-dimensional photonic integrated structure, including:
- a first semiconductor on insulator substrate including a first insulating layer and a first semiconductor film, wherein the first semiconductor film is patterned to form a first waveguide and a first film portion;
- a second semiconductor on insulator substrate including a second insulating layer and a second semiconductor film, wherein the second semiconductor film is patterned to form a second waveguide and an optical coupler;
- a third insulating layer covering the first semiconductor film;
- wherein a top surface of the third insulating layer is bonded to a bottom surface of the second insulating layer to mount the first semiconductor on insulator substrate to the second semiconductor on insulator substrate;
- and
- a reflective element located below said optical coupler, wherein the reflective element is formed by said first film portion, a portion of the third insulating layer and a portion of the second insulating layer.
A three-dimensional photonic integrated structure, including:
- a first semiconductor on insulator substrate including a first insulating layer and a first semiconductor film, wherein the first semiconductor film is patterned to form a first waveguide and a first film portion;
- a second semiconductor on insulator substrate including a second insulating layer and a second semiconductor film, wherein the second semiconductor film is patterned to form a second waveguide and an optical coupler;
- wherein the second semiconductor on insulator substrate is bonded to the first semiconductor on insulator substrate through a third insulating layer;
- and
- wherein said first film portion, a portion of the second insulating layer and a portion of the third insulating layer form a reflective element located below said optical coupler.
Dependencies are inferred from the claim text.