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US 11,231,491 B2Granted
Robust ultrasound transducer probes having protected integrated circuit interconnects
AssigneeKoninklijke Philips N.V.
InventorsMichael Scarsella, Wojtek Sudol
Life of this patent
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Abstract
An ultrasound probe is formed with protected interconnects, thereby resulting in a more robust probe. The interconnects are mounted between an array of transducer elements and an integrated circuit. The array of transducer elements are coupled to the interconnect via flip chip bumps or other structures. Underfill material fixedly positions the interconnects to the integrated circuit. A method of making the transducer assembly is provided.
Claims11
An ultrasonic transducer array assembly comprising:
- an array of transducer elements comprising a plurality of functioning transducer elements and a non-functioning transducer element, wherein the non-functioning transducer element comprises a plurality of layers that is the same as the plurality of layers of the plurality of functioning transducer elements;
- an integrated circuit comprising a first side and an opposing second side;
- an underfill material positioned between the first side of the integrated circuit and a bottom layer of the plurality of layers, the underfill material structurally coupling the array of transducer elements and the integrated circuit;
- a backing block positioned on the second side of the integrated circuit;
- and
- a flexible circuit electrically connected to the integrated circuit, the flexible circuit having an end structurally coupled directly to the integrated circuit, wherein the end of the flexible circuit is fixedly positioned, by the underfill material, over the first side of the integrated circuit and under the non-functioning transducer element.
3 more elements
A method of making an ultrasonic transducer array assembly, the method comprising:
- structurally coupling an end of a flexible circuit directly to a first side of an integrated circuit such that the flexible circuit is electrically connected to the integrated circuit;
- and
- positioning an underfill material between the first side of the integrated circuit and a bottom layer of a plurality of layers such that the underfill material:
- structural couples the integrated circuit to an array of transducer elements comprising a plurality of functioning transducer elements and a non-functioning transducer element, wherein the non-functioning transducer element comprises the plurality of layers that is the same as the plurality of layers of the plurality of functioning transducer elements;
- and
- fixedly positions the end of the flexible circuit between the first side of the integrated circuit and under the non-functioning transducer element.
3 more elements
An apparatus, comprising:
- a medical ultrasound transducer probe configured to image a body of a patient, wherein the medical ultrasound transducer probe comprises an ultrasonic transducer array assembly, wherein the ultrasonic transducer array assembly comprises:
- an array of transducer elements comprising a plurality of functioning transducer elements and a non-functioning transducer element, wherein the non-functioning transducer element comprises a plurality of layers that is the same as the plurality of layers of the plurality of functioning transducer elements;
- an integrated circuit comprising a first side and an opposing second side;
- an underfill material positioned between the first side of the integrated circuit and a bottom layer of the plurality of layers, the underfill material structurally coupling the array of transducer elements and the integrated circuit;
- a backing block positioned on the second side of the integrated circuit;
- and
- a flexible circuit electrically connected to the integrated circuit, the flexible circuit having an end structurally coupled directly to the integrated circuit, wherein the end of the flexible circuit is fixedly positioned, by the underfill material, over the first side of the integrated circuit and under the non-functioning transducer element.
4 more elements
Dependencies are inferred from the claim text.