Sensor unit, vehicle positioning device, and vehicle
AssigneeSeiko Epson Corporation
InventorsTaketo Chino, Yoshikuni Saito
Life of this patent
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Abstract
A sensor unit includes a circuit board including, on a first surface, a plurality of electrode pads to which a plurality of mounting terminals of an inertial sensor are respectively attached via connecting members. The first surface of the circuit board includes an insulating layer provided on the outer side of the plurality of electrode pads in a plan view, includes, in a portion overlapping a center region further on the inner side than the mounting terminals of the inertial sensor in the plan view, a first region where the insulating layer is not provided, and includes, from the first region to the outer side of the inertial sensor in the plan view, a second region where the insulating layer is not provided.
Claims19
A sensor unit comprising:
- an inertial sensor including a plurality of mounting terminals;
- a circuit board including a first surface;
- a plurality of electrode pads on the first surface;
- a peripheral projection or an unconnected projection located between a center of the inertial sensor and the electrode pads in a plan view;
- connecting members respectively attaching the plurality of electrode pads to the plurality of mounting terminals;
- and
- a case internally housing the circuit board,
- wherein the first surface of the circuit board includes:
- an insulating layer surrounding each of the plurality of electrode pads in the plan view;
- a first region free of the insulating layer, the first region facing a center region of the inertial sensor in the plan view and being inboard of the mounting terminals, and
- a second region free of the insulating layer, the second region extending from the first region to an outer side of the inertial sensor in the plan view.
A sensor unit comprising:
- an inertial sensor including a plurality of mounting terminals;
- a circuit board including a first surface;
- a plurality of electrode pads on the first surface;
- and
- connecting members respectively attaching the plurality of electrode pads directly to the plurality of mounting terminals;
- wherein the first surface of the circuit board includes:
- an insulating layer surrounding each of the plurality of electrode pads in a plan view;
- and
- a relief pattern which is devoid of the insulating layer,
- wherein the relief pattern includes:
- a first well peripherally framed by the plurality of electrode pads and superposed with a center region of the inertial sensor,
- a plurality of second wells dispersed circumferentially outboard of the first well, and
- a plurality of grooves respectively interconnecting the plurality of second wells and the first well, each groove having a proximal end fluidly communicating with the first well and a distal end fluidly communicating with one of the second wells, and
- wherein each of the second wells protrudes beyond a peripheral edge of the inertial sensor in the plan view.
Dependencies are inferred from the claim text.