Vertical electroplating module and electroplating method for fan-out panel level chip

A vertical electroplating module for a fan-out panel level chip, at least comprising:

• an electroplating tank module comprising a first box, wherein the first box has a first receiving chamber, a second receiving chamber and a third receiving chamber therein, the first receiving chamber has an electroplating anode mesh therein, the first receiving chamber and the second receiving chamber communicate with each other, the second receiving chamber and the third receiving chamber communicate with each other, a wall of the second receiving chamber has an opening thereon, the opening has fins thereon, electroplating liquid in the first receiving chamber flows to a bottom of the second receiving chamber, and the electroplating liquid flows to the third receiving chamber from a top of the second receiving chamber;
• an exhaust tank module communicate with the first receiving chamber and the third receiving chamber respectively via a first pump and a second pump, wherein the first pump pumps the electroplating liquid in the exhaust tank module to the first receiving chamber, the electroplating liquid flows to the third receiving chamber from a top of the second receiving chamber, and the second pump pumps the electroplating liquid in the third receiving chamber to the exhaust tank module;
• and
• a clamping module surrounds the opening to cover a product on the opening.