Plating processing apparatus

A plating processing apparatus in which a plating object is immersed in a plating solution to form a plating layer on a surface of the plating object, the plating processing apparatus comprising:

• a plating tank containing the plating solution;
• a power supply roller rotated while supplying electric power to the plating object, and conveying the plating object to be immersed into the plating solution contained in the plating tank and then moved to outside of the plating solution;
• an anode case disposed inside the plating tank and held in electrical contact with the plating solution contained in the plating tank;
• a control panel controlling electric power supplied to the power supply roller and the anode case;
• a first busbar electrically connecting the power supply roller and the control panel;
• and
• a second busbar electrically connecting the anode case and the control panel,
• wherein the first busbar and the second busbar are each constituted by a plurality of busbar members each of which includes a copper-made base member and a titanium-made coating layer covering a surface of the base member,
• each busbar member of the respective plurality of busbar members constituting the first busbar and the second busbar includes (i) a first connection portion connected to another busbar member of the respective plurality of busbar members, and (ii) a second connection portion connected to the power supply roller, the anode case, or the control panel, and
• a portion of each busbar member other than the first connection portion and the second connection portion includes a gap between the base member and the coating layer.