Method of removing liquid from seal of a substrate holder
AssigneeEbara Corporation
InventorsMasaya Seki, Hideki Takayanagi, Kiyoshi Suzuki, Masayuki Satake, Jumpei Fujikata
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AssigneeEbara Corporation
InventorsMasaya Seki, Hideki Takayanagi, Kiyoshi Suzuki, Masayuki Satake, Jumpei Fujikata
Estimating the term…
A method capable of removing a liquid from a seal of a substrate holder so as to prevent contact between the liquid and an electrical contact of the substrate holder is provided. The method includes: immersing the substrate in a plating solution, with a seal and an electrical contact of the substrate holder in contact with the substrate; applying a voltage between the substrate and an anode in the presence of the plating solution to plate the substrate; pulling up the plated substrate from the plating solution; separating the seal from the plated substrate; and forming a flow of gas passing through a gap between the plated substrate and the seal, the flow of gas being directed from an inside to an outside of the substrate holder.
A method of plating a substrate with use of a substrate holder, comprising:
A method of plating a substrate with use of a substrate holder, comprising:
Dependencies are inferred from the claim text.