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US 11,230,783 B2Granted
Method and system for electroplating a MEMS device
AssigneeTexas Instruments Incorporated
InventorsDonald Charles Abbott, Kathryn Ann Schuck
Life of this patent
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Abstract
In described examples, a method for electroplating a semiconductor device includes: forming a metal foil; forming an inert anode support; attaching the metal foil to the inert anode support to form an anode; forming a cathode using a semiconductor substrate; immersing the anode and the cathode within an electrolyte solution; forming a circuit with a current source, the anode and the cathode; generating a current through the circuit; and electroplating a metal from the electrolyte solution onto the semiconductor substrate.
Claims12
A system, comprising:
- an anode comprising an inert anode support and a metal foil attached to the inert anode support, wherein the inert anode support comprises multiple rings in an eccentric pattern;
- an electrolyte solution around the anode;
- and
- a circuit connected to the anode.
1 more element
Dependencies are inferred from the claim text.