Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank
AssigneeEbara Corporation
InventorsJunitsu Yamakawa, Chunhui Dou, Risa Kimura, Toshio Yokoyama
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Abstract
The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.
Claims3
A copper oxide solid to be supplied into a plating solution for plating a substrate, comprising:
- a copper oxide powder;
- and
- a liquid as a binder to bind the copper oxide powder, the liquid comprising the plating solution to which no additives have been added.
Dependencies are inferred from the claim text.