Substrate plating method

A substrate plating method comprising:

• forming a first resist film on a first face of a substrate in such a manner that the first resist film has an opening on a plating-scheduled region of the first face and exposes a first feeding layer in at least a portion of an outer edge of the first face;
• forming a second resist film on a second face of the substrate opposite to the first face in such a manner that the second resist film exposes a second feeding layer in at least a portion of an outer edge of the second face;
• holding the substrate with a clamp member in such a manner that the clamp member is in contact with the first feeding layer and the second feeding layer, and arranging a first electrode in opposed relation with the first face of the substrate and a second electrode in opposed relation with the second face of the substrate;
• and
• forming a plating layer on the plating-scheduled region of the first face while using the first resist film as a mask under conditions in which a value of current supplied between the second face of the substrate and the second electrode is larger than a value of current supplied between the first face of the substrate and the first electrode.