Cobalt chemistry for smooth topology
AssigneeMacDermid Enthone Inc.
InventorsShaopeng Sun, Kyle Whitten, Stephan Braye, Elie Najjar
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Abstract
An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH adjuster; and (4) an organic additive, which contains a suppressor. The electroplated cobalt deposit exhibits a level surface such that the thickness difference across substantially the entire surface of the substrate of less than about 200 nm.
Claims21
A method of electrodepositing cobalt onto a substrate comprising recessed features and non-feature areas, wherein the cobalt deposit exhibits a thickness difference across the surface of the substrate of less than about 200 nm the method comprising:
- a) receiving the substrate in an electroplating chamber;
- b) immersing the substrate into a cobalt electrolyte, the cobalt electrolyte comprising:
- (1) a source of cobalt ions;
- (2) boric acid;
- (3) a pH adjuster;
- and
- (4) an organic additive, wherein the organic additive comprises a suppressor;
- and
- c) electroplating cobalt into the features and onto the non-feature areas for a period of time and under conditions to achieve a level, seam-free, bottom-up fill in the recessed features and plating on the non-feature areas;
- wherein the cobalt deposit exhibits a potentiodynamically measured hysteresis loop in a cyclic voltammetry scan at a current density in a range of 5 to about 10 mA/cm2 of less than about 50 mV.
A method of electrodepositing cobalt onto a substrate comprising recessed features and non-feature areas, wherein the cobalt deposit exhibits a thickness difference across the surface of the substrate of less than about 200 nm the method comprising:
- a) receiving the substrate in an electroplating chamber;
- b) immersing the substrate into a cobalt electrolyte, the cobalt electrolyte comprising:
- (1) a source of cobalt ions;
- (2) boric acid;
- (3) a pH adjuster;
- and
- (4) an organic additive, wherein the organic additive comprises a suppressor;
- and
- c) electroplating cobalt into the features and onto the non-feature areas for a period of time and under conditions to achieve a level, seam-free, bottom-up fill in the recessed features and plating on the non-feature areas;
- wherein the plated cobalt deposit exhibits a potentiodynamically measured hysteresis loop in a cyclic voltammetry scan at a current density in a range of about 1 to less than 5 mA/cm2 of less than about 90 mV.
Dependencies are inferred from the claim text.