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US 11,230,762 B2Granted
Film structure reproduction method and reproduction film structure
AssigneeAdmap Inc.
InventorMasaki Nakamura
Life of this patent
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Abstract
A method of easily reproducing a film structure with low cost and a reproduction film structure manufactured using the same, the film structure reproduction method includes: a new film layer deposition step of depositing a new SiC layer on a non-active surface opposite to a damaged active surface; and an active surface fabrication step of fabricating the active surface to obtain a focus ring.
Claims2
A film structure reproduction method comprising:
- a new film layer deposition step of depositing a new film layer on a surface opposite to a damaged surface having a thickness equal to or larger than a depth of a deepest damage by setting the surface opposite to the damaged surface as a main body formation surface;
- and
- an active surface fabrication step of fabricating the damaged surface to have a desired shape,
- wherein, in the new film layer deposition step, deposition is performed while damaged surfaces of two film structures face each other,
- in the active surface fabrication step, fabrication is performed until a depth at which the damaged surface is completely removed, and
- a space formed between the damaged surfaces of the two film structures facing each other is smaller than the thickness of the new film layer.
3 more elements
Dependencies are inferred from the claim text.