Adhesive film and a flat wiring member using the same
AssigneeHitachi Metals, Ltd.
InventorsDaisuke Shanai, Akinari Nakayama, Kenichi Murakami, Kazuhiko Sasada, Masanobu Yamanobe
Life of this patent
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Abstract
An adhesive film includes a resin film; and an adhesive layer provided on the resin film. The adhesive layer includes a resin composition including 2 parts by mass or more of an epoxy resin including two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, per 100 parts by mass of an amorphous resin, which is soluble to a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 5 KOHmg/g or more. A flat wiring member includes a conductor and the adhesive film as described above.
Claims12
An adhesive film, comprising:
- a resin film;
- and
- an adhesive layer provided on the resin film, wherein the adhesive layer comprises:
- a resin composition consisting of:
- an epoxy resin having two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, and an amorphous resin which is dissolved in a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 10 KOHmg/g or more;
- and
- a flame retardant;
- a filler (A) having a specific surface area (m2/g) of 90 or more by a BET method;
- and
- a filler (B) having an average particle diameter (median diameter) of 1 μm or more and 10 μm or less by a laser diffraction method,
- wherein an amount of the resin composition is 2 parts by mass or more of the epoxy resin per 100 parts by mass of the amorphous resin.
An adhesive film, comprising:
- a resin film;
- and
- an adhesive layer provided on the resin film, wherein the adhesive layer comprises:
- a resin composition consisting of:
- an epoxy resin having two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less;
- an amorphous resin which is dissolved in a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 10 KOHmg/g or more;
- and
- a flame retardant;
- a filler (A) having a specific surface area (m2/g) of 90 or more by a BET method;
- and
- a filler (B) having an average particle diameter (median diameter) of 1 μm or more and 10 μm or less by a laser diffraction method,
- wherein an amount of the resin composition is 2 parts by mass or more of the epoxy resin per 100 parts by mass of the amorphous resin, and
- wherein a specific gravity of the flame retardant is 1.5 or less.
A flat wiring member, comprising:
- a conductor;
- and
- an adhesive film provided to sandwich the conductor, the adhesive film comprising a resin film and the adhesive layer provided on the resin film,
- wherein the adhesive layer comprises:
- a resin composition consisting of:
- an epoxy resin having two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, and an amorphous resin, which is dissolved in a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 10 KOHmg/g or more;
- and
- a flame retardant;
- a filler (A) having a specific surface area (m2/g) of 90 or more by a BET method;
- and
- a filler (B) having an average particle diameter (median diameter) of 1 μm or more and 10 μm or less by a laser diffraction method,
- wherein the adhesive layer has a crosslinked structure formed by reactions between the carboxyl group of the amorphous resin and the epoxy group of the epoxy resin, and
- wherein a ratio of an intrusion of a detection stick with respect to a thickness of the adhesive layer at a temperature of 200° C., in a TMA curve (wherein a diameter of an indenter at a tip of the detection stick is 0.5 mm, a load is 0.5N, and a temperature increasing rate is 5° C./m) provided by JIS K7196, is not more than 50%.
Dependencies are inferred from the claim text.