Composite sintered body, semiconductor manufacturing apparatus member, and method of manufacturing composite sintered body
AssigneeNGK Insulators, Ltd.
InventorsEn Yagi, Yuji Katsuda
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Abstract
The composite sintered body includes AlN and MgAl2O4. The open porosity of the composite sintered body is lower than 0.1%. The relative density of the composite sintered body is not lower than 99.5%. The total percentage of the AlN and the MgAl2O4 contained in the composite sintered body is not lower than 95 weight percentage and not higher than 100 weight percentage. The percentage of the MgAl2O4 contained in the composite sintered body is not lower than 15 weight percentage and not higher than 70 weight percentage. It is thereby possible to provide a high-density composite sintered body having high plasma corrosion resistance, high volume resistivity, and high thermal conductivity.
Claims13
A composite sintered body, comprising:
- aluminum nitride;
- and
- spinel,
- wherein the open porosity is lower than 0.1%,
- the relative density is not lower than 99.5%,
- the total percentage of said aluminum nitride and said spinel contained in said composite sintered body is not lower than 95 weight percentage and not higher than 100 weight percentage, and
- the percentage of said spinel contained in said composite sintered body is not lower than 15 weight percentage and not higher than 70 weight percentage.
Dependencies are inferred from the claim text.