Semiconductor substrate support with multiple electrodes and method for making same
AssigneeWatlow Electric Manufacturing Company
InventorMichael Parker
Life of this patent
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Abstract
A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.
Claims6
An electrostatic chuck, comprising a plate assembly formed from a first ceramic layer joined to a second ceramic layer with a metal joining layer, the plate assembly being provided with a plurality of grooves extending through the first ceramic layer and through the metal joining layer to provide one or more electrode portions formed from the metal joining layer and a dielectric material disposed in the plurality of grooves in at least the metal joining layer so as to electrically isolate the plurality of electrode portions from each other.
Dependencies are inferred from the claim text.