Package-integrated bistable switch for electrostatic discharge (ESD) protection
AssigneeIntel Corporation
InventorsFeras Eid, Veronica Aleman Strong, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan
Life of this patent
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Abstract
Embodiments may relate to a package substrate that includes a signal line and a ground line. The package substrate may further include a switch communicatively coupled with the ground line. The switch may have an open position where the switch is communicatively decoupled with the signal line, and a closed position where the switch is communicatively coupled with the signal line. Other embodiments may be described or claimed.
Claims19
A package substrate for use in a microelectronic package, wherein the package substrate comprises:
- a signal line to carry a data signal to a die of the microelectronic package;
- a ground line coupled to a ground of the microelectronic package;
- and
- a switch that is communicatively coupled with the ground line, wherein:
- the switch has a first position such that the switch is also communicatively coupled with the signal line,
- the switch has a second position such that the switch is communicatively separated from the signal line, and
- the switch is in a cavity of a layer of the package substrate.
A microelectronic package comprising:
- a die;
- and
- a package substrate coupled with the die, wherein the package substrate includes:
- a signal line to carry a data signal between the die and an interconnect of the package substrate;
- a ground line that is coupled with ground;
- and
- a switch that is coupled with the ground line, wherein:
- the switch is operable to selectively couple with the signal line at a first position or decouple from the signal line at a second position, and
- the switch is in a cavity of a layer of the package substrate.
A method of forming a package substrate for use in a microelectronic package, wherein the method comprises:
- forming, in a package substrate, a signal line that is to convey a data signal to or from a die;
- forming, in a package substrate, a ground line that is coupled with ground;
- and
- positioning, in a cavity in a layer of the package substrate, a physical switch that is coupled with the ground line, wherein the physical switch has a first position that is coupled with the signal line and the physical switch has a second position that is decoupled from the signal line.
Dependencies are inferred from the claim text.