US 11,219,119 B2Granted

Method for providing an electrical connection and printed circuit board

AssigneeAdvantest Corporation

InventorSylvia Ehrler

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Abstract

Method for providing an electrical connection, comprising connecting a first cable to a first conducting structure on a printed circuit board, connecting a second cable to a second conducting structure on the printed circuit board, comparing a propagation delay of a first signal path comprising the first cable and the first conducting structure on the printed circuit board, and a propagation delay of a second signal path comprising the second cable and the second conducting structure on the printed circuit board; and removing conductive material of the first conducting structure and/or of the second conducting structure, in order to modify an electrical length of the first conducting structure and/or of the second conducting structure, to obtain a first conducting path and a second conducting path, in dependence on a result of the comparison, in order to reduce a difference of the propagation delays between the first signal path and the second signal path.

Claims12

Dependent claims

A electronic device comprising

a first contact pad for receiving a first signal from a first cable;
a second contact pad for receiving a second signal from a second cable;
a third contact pad contacting a device;
a fourth contact pad contacting the device;
a first conducting path connecting the first contact pad and the third contact pad, wherein the first conducting path comprises a first non-removable conductor and a first removable conductor;
and
a second conducting path connecting the second contact pad and the fourth contact pad, wherein the second conducting path comprises a second non-removable conductor and a second removable conductor, wherein the first and the second removable conductors are configured to compensate for a propagation delay difference between the first and the second signals through the first and the second conducting paths by removal of the first and the second removable conductors respectively;
wherein a shape of the first removable conductor and a shape of the second removable conductor are trapezoidal, wherein a shape of the first non-removable conductor is continuous and comprises uniform thickness, wherein the first non-removable conductor comprises an indentation, and wherein the first non-removable conductor fits within a recess created by the indentation in the first non-removable conductor.

5 more elements

A printed circuit board comprising:

a first contact pad contacting a first cable;
a second contact pad contacting a second cable;
a third contact pad contacting a device;
a fourth contact pad contacting the device;
a first conducting structure forming a first conducting path connecting the first contact pad and the third contact pad, wherein the first conducting structure comprises a first non-removable conductor and a first removable conductor;
and
a second conducting structure forming a second conducting path connecting the second contact pad and the fourth contact pad,
wherein the first conducting structure and the second conducting structure are configured to avow modification of a propagation delay by definition of shapes of the first conducting path and second conducting path;
wherein the second conducting structure comprises a second non-removable conductor and a second removable conductor, wherein a shape of the first removable conductor and a shape of the second removable conductor are trapezoidal, wherein a shape of the first non-removable conductor is continuous and comprises uniform thickness, wherein the first non-removable conductor comprises an indentation, and wherein the first non-removable conductor fits within a recess created by the indentation in the first non-removable conductor.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 16/844,306Filed 9 Apr 2020 · continuation
Priority: 7 Mar 2019
Published: US 2020/0288564 A110 Sep 2020
Granted: 4 Jan 2022
Term ends: Not estimatedThe source records don’t support an estimate.

Classification25 codes

H05K 1/0248
High frequency adaptations: skew reduction or using delay lines
H05K 1/0213
Details: electrical arrangements not otherwise provided for
H05K 1/0245
High frequency adaptations: lay-out of balanced signal pairs, e.g. differential lines or twisted lines
H05K 1/0293
Programmable, customizable or modifiable circuits: individual printed conductors which are adapted for modification, e.g. fusable or breakable…