Methods for cleaning semiconductor device manufacturing apparatus
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsIan Hsieh, Che-fu Chen, Yan-Hong Liu
Life of this patent
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Abstract
The present disclosure describes a chuck-based device and a method for cleaning a semiconductor manufacturing system. The semiconductor manufacturing system can include a chamber with the chuck-based device configured to clean the chamber, a loading port coupled to the chamber and configured to hold one or more wafer storage devices, and a control device configured to control a translational displacement and a rotation of the chuck-based device. The chuck-based device can include a based stage, one or more supporting rods disposed at the base stage and configured to be vertically extendable or retractable, and a padding film disposed on the one or more supporting rods.
Claims20
A method for cleaning a chamber of a semiconductor device manufacturing apparatus, comprising:
- determining a contamination level in the chamber, wherein the chamber comprises an electrostatic chuck (ESC);
- in response to the contamination level being equal to or above a reference level, loading a padding film on a substrate that is supported by one or more vertically retractable supporting rods on a stage of the ESC;
- and
- moving, by displacing the stage of the ESC and stretching or retracting the one or more supporting rods, the padding film in contact with a component in the chamber.
A method for operating an electrostatic chuck (ESC) to clean a chamber, comprising:
- in response to a comparison result that a contamination level in the chamber is equal to or above a reference level, placing a padding film on a carrier substrate;
- placing the carrier substrate on or re or more vertically retractable supporting rods on a stage of the ESC;
- and
- shifting and rotating the padding film by displacing and rotating the stage of the ESC and stretching or retracting the one or more supporting rods, to conduct a wiping activity on a target inside the chamber.
A method for cleaning a chamber of a semiconductor device manufacturing apparatus, comprising:
- conducting one or more semiconductor manufacturing processes in the semiconductor device manufacturing apparatus, wherein a contaminant from the one or more semiconductor manufacturing processes adheres to a component in the chamber, and wherein the chamber comprises an electrostatic chuck (ESC);
- placing a padding film on a carrier substrate;
- placing the carrier substrate on one or more vertically retractable supporting rods on a stage of the ESC;
- displacing the stage of the ESC and stretching the one or more supporting rods to move the padding film to be in contact with the component;
- and
- shifting and rotating the padding film to remove the contaminant from the component.
Dependencies are inferred from the claim text.