Solder processing device

A solder processing device which includes:

• a tubular iron tip that can be heated and that is extended vertically;
• a solder piece supply portion that includes one or more cutter blades that cut wire solder to produce a solder piece and supplies the solder piece into the iron tip;
• and
• a heater unit that includes a heater block and a heater that heats the heater block, the heater block including a concave portion to which the iron tip is attached such that a solder supply hole of the heater block is connected to and communicated with a solder hole of the iron tip such that the solder piece is supplied from the solder piece supply portion to the solder hole of the iron tip via the solder supply hole of the heater block, wherein
• heat of the iron tip is used to melt the solder piece in the iron tip such that the molten solder is supplied downward,
• the iron tip includes a reception portion protruding inwardly from an inner wall of the iron tip such that the reception portion receives the supplied solder piece thereon in the iron tip,
• in a state where the solder piece is held so as to be erected on the reception portion, the supplied solder piece is brought into contact with the inner wall of the iron tip and melted, and
• the heater block includes an upper surface and a lower surface opposite to each other in the vertical direction, the concave portion is recessed from the lower surface of the heater block, and an upper end of the iron tip is inserted in and attached to the concave portion in such a manner that the solder supply hole of the heater block is connected to and communicated with the solder hole of the iron tip.