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US 11,206,739 B2Granted
Potting method
AssigneeGoodrich Actuation Systems Limited
InventorsDavid Abraham, Stuart Waller
Life of this patent
Estimating the term…
Abstract
A method of potting e.g. a stack of printed circuit boards, the method comprising applying a first potting material to selected regions of the circuit to be potted and then applying a second, different, potting material over the circuit to be potted.
Claims5
A method of potting a circuit unit comprising a stack of two or more printed circuit boards, the method comprising:
- stacking the two or more printed circuit boards connected by interconnections to assemble the circuit unit;
- performing a first potting stage by applying a first potting material to pot selected regions of the circuit unit following assembly of the circuit unit through the stacking, wherein the selected regions include one or more printed circuit boards of a lower part of the stack or one or more interconnections of the lower part of the stack;
- and
- performing a second potting stage by applying a second, different potting material over the circuit unit and over the first potting material, wherein the first potting material has a lower density than the second potting material.
1 more element
A potted circuit unit comprising:
- a circuit unit comprising a stack of two or more printed circuit boards connect by interconnections;
- a first potting material applied to pot selected regions of the circuit unit after the two or more printed circuit boards are stacked to assemble the circuit unit, wherein the selected regions include one or more printed circuit boards of a lower part of the stack or one or more interconnections of the lower part of the stack;
- and
- a second, different potting material applied over the circuit unit and over the first potting material, wherein the first potting material has a lower density than the second potting material.
1 more element
Dependencies are inferred from the claim text.