Adaptive baking method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTzung-Chen Wu, Wen-Zhan Zhou, Heng-Jen Lee, Ho-Yung David Hwang
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Abstract
A method includes supporting a wafer on a heating element, wherein the heating element is located in a baking chamber. The method further includes heating the wafer for a first duration using the heating element. The method further includes measuring a temperature of the heating element and a temperature of the wafer during the first duration to obtain temperature information. The method further includes adjusting an amount of heat provided by the heating element during the first duration, wherein the adjusting of the amount of heat includes decreasing the amount of heat provided by the heating element as a rate of change of the temperature information versus time increases.
Claims20
A method comprising:
- supporting a wafer on a heating element, wherein the heating element is located in a baking chamber;
- performing a baking process on an entirety of the wafer, wherein the baking process comprises heating the wafer for a first duration using the heating element;
- measuring a temperature of the heating element and a temperature of the wafer during the first duration to obtain temperature information related to both the heating element and the wafer;
- and
- adjusting an amount of heat provided by the heating element during the first duration, wherein the adjusting of the amount of heat comprises decreasing the amount of heat provided by the heating element as a rate of change of the temperature information versus time increases.
A method comprising:
- supporting a wafer on a heating element, wherein the heating element is located in a baking chamber;
- performing a baking process on an entirety of the wafer, wherein the baking process comprises heating the wafer for a first duration using the heating element;
- measuring a temperature of the heating element and a temperature of the wafer during the first duration to obtain temperature information related to both the heating element and the wafer;
- and
- increasing a duration of the baking process beyond the first duration in response to the temperature information.
A method comprising:
- supporting a wafer on a heating element, wherein the heating element is located in a baking chamber;
- performing a baking process on an entirety of the wafer, wherein the baking process comprises heating the wafer for a first duration using the heating element;
- measuring a temperature of the heating element and a temperature of the wafer during the first duration to obtain temperature information related to both the heating element and the wafer;
- and
- controlling the heating element based on the temperature information, wherein controlling the heating element comprises:
- adjusting an amount of heat provided by the heating element during the first duration, wherein the adjusting of the amount of heat comprises decreasing the amount of heat provided by the heating element as a rate of change of the temperature information versus time increases, or
- increasing a duration of the baking process beyond the first duration in response to the temperature information.
Dependencies are inferred from the claim text.