Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator
AssigneeSika Technology AG
InventorsAndreas Kramer, Jürgen Finter, Karsten Frick, Urs Rheinegger, Jan Olaf Schulenburg
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Abstract
Heat-curing epoxy resin compositions are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions.
Claims22
A method of adhesively bonding heat-stable materials with improved impact peel strength, comprising:
- contacting a first heat-stable material with a heat-curing epoxy resin composition;
- applying a second heat-stable material to said heat-curing epoxy resin composition on said first heat-stable material;
- and
- curing the heat-curing epoxy resin composition at a temperature of from 100 to 220° C. to bond the first and second heat-stable materials together;
- wherein the heat-curing epoxy resin composition comprises:
- 10% to 85% by weight, based on the overall weight of the composition, of (A) at least one epoxy resin having on average more than one epoxide group per molecule;
- 0.1% to 30% by weight, based on the weight of (A), of (B) a dicyandiamide hardener;
- 0.02% to 0.85% by weight, based on the weight of (A), of (C) an accelerant;
- 0.1% to 50% by weight, based on the overall weight of the composition, of (D) at least one toughener;
- 2% to 50% by weight, based on the overall weight of the composition, of (F) at least one filler;
- and
- 0.1%-20% by weight, based on the overall weight of the composition, of (G) at least one reactive diluent which carries one or more epoxy groups per molecule;
- wherein (A) comprises a liquid epoxy resin having the formula (A-II) and optionally a solid epoxy resin of the formula (A-I):
- wherein R′″ and R″″ independently of one another are either H or CH3, and r is from 0 to 1, and
- wherein R′ and R″ independent of one another are either H or CH3, and s is >1.5;
- wherein (C) is selected from compounds of formula (Ia) and compounds of formula (Ib):
- wherein:
- R1 is H or an n′-valent aliphatic, cycloaliphatic or araliphatic radical;
- R2 and R3 either each independently of one another are an alkyl group or aralkyl group;
- or
- together are a divalent aliphatic radical having 3 to 20 C atoms which is part of an optionally substituted heterocyclic ring having 5 to 8 ring atoms;
- R1′ is an n′-valent aliphatic, cycloaliphatic or araliphatic radical;
- R2′ is an alkyl group or aralkyl group;
- R3′ independently at each occurrence is H or an alkyl group or aralkyl group;
- and
- n and n′ are each from 1 to 4;
- wherein (D) comprises a blocked polyurethane polymer and optionally further comprises one or more of liquid rubbers, epoxy-modified liquid rubbers, and core-shell polymers;
- and
- wherein the heat-cured epoxy resin composition provides an impact peel strength between the first and second heat-stable materials that is higher than an impact peel strength of a similar heat-cured epoxy resin composition, which is formulated with components (A), (B), (D), (F), and (G), but not with component (C).
Dependencies are inferred from the claim text.