Blow molding device capable of continuous processing

A blow molding device comprising:

• a heating unit configured to heat a molding material;
• and
• molds configured to load and mold the molding material therebetween,
• wherein the heating unit includes,
• an infrared lamp configured to emit infrared rays,
• a reflective mirror configured to concentrate the infrared rays emitted from the infrared lamp, and
• a light transmitting body configured to receive the infrared rays concentrated by the reflective mirror and transmit the concentrated infrared rays to the molding material,
• wherein the molds are configured to mold the molding material by using a gas pressure applied to surfaces of the molding material that has been heated to a temperature by the infrared rays transmitted from the light transmitting body,
• wherein the molds include a first chamber and a second chamber that accommodate the molding material therebetween and define spaces in which the gas pressure is formed,
• wherein the first chamber is fixedly coupled to the heating unit, and the first chamber includes a window at one side of the first chamber and a sealing surface at the other side of the first chamber, the window configured to accommodate the light transmitting body of the heating unit therethrough, the sealing surface configured to come into contact with the molding material, the sealing surface and the window configured to form a first space therebetween, and the first space including an inlet port configured to introduce a gas having a pressure and a first discharge port configured to discharge air from the first space,
• wherein the second chamber has a loading surface on which the molding material is loaded, the second chamber is configured to be closed as the molding material is placed on the loading surface, the second chamber has a second space having a shape corresponding to a shape into which the molding material is to be molded, and the second space has a second discharge port configured to discharge air therefrom,
• wherein the first chamber and the second chamber are configured to be moved between a first position, at which the first chamber and the second chamber are moved to be close to each other such that the molding material is accommodated between the sealing surface and the loading surface, and a second position, at which the first chamber and the second chamber are moved to be spaced apart from each other such that the molding material is loaded on the second chamber or the molded molding material is separated from the second chamber, and
• wherein at the first position of the first chamber and the second chamber, the heating unit heats the molding material is heated to the temperature, the inlet port of the first chamber introduces the gas having the pressure into the first chamber, and the second discharge port of the second chamber discharges air from the second chamber, such that the molding material is molded in the second space of the second chamber.