System and method for large-scale PCB production including continuous selective adhesion

A method of producing a large quantity of printed circuit boards, the method comprising:

• conveying with a first mechanical conveyor a plurality of mounts along a production line;
• physically applying from a first roll of a first plurality of printed circuit traces one or more first printed circuit traces to each mount as the mount is conveyed along the production line, wherein each first printed circuit trace is produced using a selective adhesion process;
• physically applying from a first roll of a first plurality of circuit components one or more first circuit components to at least one of the one or more first printed circuit traces on each mount as the mount is conveyed along the production line to produce the large quantity of printed circuit boards;
• conveying with an additional mechanical conveyor a plurality of items along the production line, wherein each item has a contoured surface;
• and
• applying one or more of the printed circuit boards to the contoured surface on each item.

A method of producing a large quantity of printed circuit boards, the method comprising:

• producing the first roll of the first plurality of printed circuit traces, including—
• providing a roll of a flexible substrate,
• providing a roll of a conductive layer,
• providing a roll of a conductive layer support,
• applying a curable adhesive between the roll of the flexible substrate and the roll of the conductive layer, and bringing together the rolls of the flexible substrate, the conductive layer, and the conductive layer support,
• repeatedly transferring a circuit pattern onto the roll of the flexible substrate, the circuit pattern including opaque areas and non-opaque areas,
• curing the curable adhesive through the non-opaque areas of each circuit pattern, resulting in bonded areas and non-bonded areas, and
• separating the non-bonded areas;
• conveying with a first mechanical conveyor a plurality of mounts along a production line;
• physically applying from the first roll of the first plurality of printed circuit traces one or more first printed circuit traces to each mount as the mount is conveyed along the production line, wherein each first printed circuit trace is produced using a selective adhesion process;
• and
• physically applying from a first roll of a first plurality of circuit components one or more first circuit components to at least one of the one or more first printed circuit traces on each mount as the mount is conveyed along the production line to produce the large quantity of printed circuit boards.