Plated terminations

A method of forming plated terminations on a multi-layer electronic component using a self-determining process, comprising the steps of:

• providing electrode layers, and providing dielectric layers which are respectively interleaved with said electrode layers and which otherwise form an insulative substrate;
• exposing selected portions of said electrode layers;
• and
• plating termination material on the exposed portions of said electrode layers using said exposed portions of said electrode layers as nucleation points and guides for the termination material;
• wherein said plating termination material step comprises electrolessly plating, wherein said electrolessly plating comprises depositing a first layer by electrolessly plating, wherein the step of depositing the first layer comprises submersing the multi- layer electronic component in an electroless copper plating solution to form a copper termination layer, further comprising the step of plating the copper termination layer with an electrically resistive layer.

A method of forming plated terminations on a multi-layer electronic component using a self-determining process, comprising the steps of:

• providing electrode layers, and providing dielectric layers which are respectively interleaved with said electrode layers and which otherwise form an insulative substrate;
• exposing selected portions of said electrode layers;
• and
• electrolessly plating termination material on the exposed portions of said electrode layers using said exposed portions of said electrode layers as nucleation points and guides for the termination material;
• wherein said electrolessly plating termination material step comprises electrolessly plating a first metal layer and then repeated electrolessly plating a second metal layer of other metal, wherein said electrolessly plating further includes covering the first layer with an electrically resistive polymeric material before plating the second layer.