Sliding member
AssigneeDaido Metal Company Ltd.
InventorMasahiro Nakai
Life of this patent
Estimating the term…
Abstract
A sliding member includes a back-metal layer including an Fe alloy and a sliding layer including a copper alloy including 0.5 to 12 mass % of Sn and the balance of Cu and inevitable impurities. The sliding layer has a cross-sectional structure perpendicular to a sliding surface of the sliding layer. The cross-sectional structure includes first copper alloy grains that are in contact with a bonding surface of the back-metal layer and second copper alloy grains that are not in contact with the bonding surface. The first copper alloy grains has an average grain size D1 and the second copper alloy grains has an average grain size D2. D1 and D2 satisfy the following relations: D1 is 30 to 80 μm; and D1/D2=0.1 to 0.3.
Claims6
A sliding member comprising:
- a back-metal layer having a back surface and a bonding surface;
- and
- a sliding layer on the bonding surface of the back-metal layer, the sliding layer having a sliding surface,
- wherein the back-metal layer comprises an Fe alloy,
- wherein the sliding layer comprises a copper alloy comprising 0.5 to 12 mass % of Sn and the balance of Cu and inevitable impurities,
- wherein the sliding layer has a cross-sectional structure perpendicular to the sliding surface, the cross-sectional structure comprising first copper alloy grains that are in contact with the bonding surface of the back-metal layer and second copper alloy grains that are not in contact with the bonding surface, and
- wherein the first copper alloy grains has an average grain size D1 and the second copper alloy grains has an average grain size D2, and D1 and D2 satisfy the following relations:
- D1 is 30 to 80 μm;
- and
- D1/D2=0.1 to 0.3.
Dependencies are inferred from the claim text.