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US 11,192,778 B2Granted
MEMS package with roughend interface
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Jui Chen, I-Shi Wang, Ren-Dou Lee, Jen-Hao Liu
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Abstract
A method includes: providing a first substrate on which a plurality of first semiconductor devices is formed; providing a second substrate on which a plurality of second semiconductor devices is formed; and coupling the first and second substrates by contacting respective dummy pads of the first and second substrates, wherein at least one of the dummy pads of the first and second substrates comprises plural peaks and valleys.
Claims20
A method, comprising:
- providing a first substrate on which a first semiconductor device is formed;
- providing a second substrate on which a second semiconductor device is formed;
- roughening a top surface of a first dummy pad extending outwardly from the first substrate;
- roughening a top surface of a second dummy pad extending outwardly from the second substrate;
- providing a first bonding pad extending outwardly from the first substrate;
- and
- providing a second bonding pad extending outwardly from the second substrate, wherein the first and second bonding pads are located so as to be bonded with each other when the first and second substrates are coupled to one another;
- coupling the first and second substrates by contacting the roughened top surfaces of the first and second dummy pads with each other so as to limit a lateral shift between the first and second substrates;
- and
- providing a metal plate around an edge of a top surface of the second substrate so as to prevent lateral shifting between the first and second substrates after they are coupled to one another.
7 more elements
A method, comprising:
- providing a first substrate on which a plurality of first semiconductor devices are formed, wherein the plurality of first semiconductor devices are at least partially surrounded by a plurality of first dummy pads;
- providing a second substrate on which a plurality of second semiconductor devices are formed, wherein the plurality of second semiconductor devices are at least partially surrounded by a plurality of second dummy pads;
- providing a first bonding pad extending outwardly from the first substrate;
- providing a second bonding pad extending outwardly from the second substrate, wherein the first and second bonding pads are located so as to be bonded with each other when the first and second substrates are coupled to one another;
- coupling the first and second substrates by contacting respective top surface of the plurality of first and second dummy pads with each other so as to limit a lateral shift between the first and second substrates;
- and
- providing a metal plate around an edge of a top surface of the second substrate so as to prevent lateral shifting between the first and second substrates after they are coupled to one another.
4 more elements
A method, comprising:
- providing a first substrate on which a first semiconductor device is formed, wherein the first semiconductor device is at least partially surrounded by a plurality of first dummy pads;
- providing a second substrate on which a second semiconductor device is formed, wherein the second semiconductor device is at least partially surrounded by a plurality of second dummy pads;
- flipping the second substrate and aligning the first semiconductor device with the second semiconductor device;
- providing a first bonding pad extending outwardly from the first substrate, the first bonding pad being at least partially surrounded by the plurality of first dummy pads;
- providing a second bonding pad extending outwardly from the second substrate, the second bonding pad being at least partially surrounded by the plurality of second dummy pads, wherein the first and second bonding pads are located so as to be bonded with each other when the first and second substrates are coupled to one another;
- coupling the first and second substrates by contacting the top surfaces of respective first and second dummy pads with each other;
- and
- providing a metal plate around an edge of a top surface of the second substrate so as to prevent lateral shifting between the first and second substrates after they are coupled to one another.
5 more elements
Dependencies are inferred from the claim text.