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US 11,189,985 B2Granted
Optoelectronic assembly
AssigneeII-Vi Delaware, Inc.
InventorsDavid Allouche, Michael Chu, Brian R. Carey, Jonathan Ashbrook, Anita Chan, Krzysztof Szczerba
Life of this patent
Estimating the term…
Abstract
An optoelectronic assembly is disclosed. The disclosed assembly includes one or more lasers formed on a first substrate, and a programmable driver circuit formed on a second substrate configured as an integrated circuit. The first and second substrates are mounted on a third substrate in a stacked arrangement.
Claims17
An optoelectronic assembly comprising:
- a printed circuit board (PCB) defining an aperture;
- a common integrated circuit substrate operably mounted directly to the PCB across the aperture;
- an emitter substrate operably mounted directly to the integrated circuit substrate adjacent the aperture;
- one or more optical emitters each configured as a backside emitting optical emitter to emit an optical signal through the aperture in response to a laser drive current, the one or more optical emitters each disposed on the emitter substrate and flip-chip mounted to a surface of the integrated circuit substrate;
- and
- a driver circuit configured to generate the laser drive current for use by the one or more optical emitters so as to produce the one or more optical signals having one or more predetermined wave form characteristics, the wave form characteristics stored in a memory component, the driver circuit and the memory component disposed on the common integrated circuit substrate;
- wherein the emitter substrate, the integrated circuitry substrate, and the PCB are positioned in a stacked arrangement with respect to one another.
4 more elements
Dependencies are inferred from the claim text.