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US 11,189,312 B1Granted
Adhesive layer for bonding noble metal structure with a dielectric layer
AssigneeSeagate Technology LLC
InventorXiaoyue Huang
Life of this patent
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Abstract
A recording head includes a structure such as a near-field transducer formed of a noble metal. An adhesive layer is formed over a surface of the structure. The adhesive layer includes alumina and is 4 nm or less in thickness. A silicon dioxide layer is formed over the adhesive layer. The adhesive layer bonds the silicon dioxide to the structure.
Claims19
A recording head, comprising:
- a dielectric substrate;
- a metal seed layer formed on the dielectric substrate;
- a near-field transducer comprising a peg, the peg formed of a noble metal on the metal seed layer, a first surface of the peg being formed on and in contact with the metal seed layer, the first surface being parallel to the dielectric substrate;
- an adhesive layer formed over a second surface of the peg using atomic layer deposition, the adhesive layer comprising alumina and being 4 nm or less in thickness, the second surface being parallel and opposed to the first surface;
- and
- a silicon dioxide layer formed over the adhesive layer, the adhesive layer bonding the silicon dioxide layer to the peg.
3 more elements
A heat-assisted recording head, comprising:
- a dielectric substrate;
- a refractive seed or refractive dopant formed on the dielectric substrate;
- a near-field transducer comprising:
- a peg, the peg formed of a noble metal;
- and
- an enlarged part formed of a different material than the noble metal, the peg extending from the enlarged part to the media-facing surface, a first surface of the peg being formed on and in contact with the refractive seed or refractive dopant, the first surface being parallel to the dielectric substrate;
- an adhesive layer formed over a second surface of the near-field transducer, the adhesive layer comprising alumina and being 4 nm or less in thickness, the second surface being parallel and opposed to the first surface;
- a silicon dioxide layer formed over the adhesive layer, the adhesive layer bonding the silicon dioxide layer to the near-field transducer-peg;
- and
- a write pole located downtrack from the peg, the silicon dioxide contacting both the peg and the write pole.
7 more elements
Dependencies are inferred from the claim text.