Back to results
US 11,181,518 B2Granted
System and method for evaluating a bond
AssigneeThe Boeing Company
InventorMorteza Safai
Life of this patent
Estimating the term…
Abstract
A system for evaluating a bond includes first and second electrodes. A dielectric material layer is positioned at least partially between the first and second electrodes. A power source is connected to the first and second electrodes. The power source is configured to cause the first and second electrodes to generate an electrical arc. The electrical arc is configured to at least partially ablate a sacrificial material layer to generate a plasma.
Claims23
A system for evaluating a bond, comprising:
- a first electrode;
- a second electrode;
- a dielectric material layer positioned at least partially between the first and second electrodes;
- a power source connected to the first and second electrodes, wherein the power source is configured to cause the first and second electrodes to generate an electrical arc, wherein the electrical arc is configured to at least partially ablate a sacrificial material layer to generate a plasma;
- and
- an inspection system that is configured to perform non-destructive inspection of the bond at least partially in response to the ablation of the sacrificial material layer, the generation of the plasma, or both.
3 more elements
A system for evaluating a bond, comprising:
- a support;
- a first electrode in contact with the support;
- a second electrode spaced apart from the support and the first electrode;
- a dielectric material layer in contact with the support, wherein the dielectric material layer is positioned at least partially between the support and the second electrode and at least partially between the first electrode and the second electrode, such that the second electrode is not in contact with the support or the first electrode;
- and
- a power source connected to the first and second electrodes, wherein the power source is configured to transmit an alternating current pulse to the first and second electrodes, which causes the first and second electrodes to generate an electrical arc, wherein the electrical arc at least partially ablates a sacrificial material layer on a bonded structure to generate a plasma, wherein the generation of the plasma generates a compression wave that is directed into the bonded structure, and wherein the compression wave reflects off of the bond in the bonded structure as a tension wave.
3 more elements
A method for evaluating a bond, comprising:
- placing a sacrificial material layer on a surface of a bonded structure;
- and
- transmitting an electrical pulse to a first electrode and a second electrode, which causes the first and second electrodes to generate an electrical arc, wherein the electrical arc at least partially ablates the sacrificial material layer to generate a plasma, wherein the generation of the plasma generates a compression wave that is directed into the bonded structure, and wherein the compression wave reflects off of the bond in the bonded structure as a tension wave.
Dependencies are inferred from the claim text.