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US 11,180,365 B2Granted
MEMS devices and methods of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKai-Chih Liang, Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee, Chung-Hsien Lin
Life of this patent
Estimating the term…
Abstract
A microelectromechanical system (MEMS) device may include a MEMS structure over a first substrate. The MEMS structure comprises a movable element. Depositing a first conductive material over the first substrate and etching trenches in a second substrate. Filling the trenches with a second conductive material and depositing a third conductive material over the second conductive material and the second substrate. Bonding the first substrate and the second substrate and thinning a backside of the second substrate which exposes the second conductive material in the trenches.
Claims20
A microelectromechanical systems (MEMS) device, comprising:
- a dielectric layer on a first substrate, the dielectric layer having a top surface opposite the first substrate, the dielectric layer having a first recess extending from the top surface of the dielectric layer, the dielectric layer having a different thickness in the first recess than outside the first recess, a portion of the dielectric layer being directly between a bottom surface of the first recess and a top surface of the first substrate;
- a MEMS substrate bonded to the dielectric layer, the MEMS substrate comprising a movable element and a static element;
- a first set of conductive electrodes over the MEMS substrate, the first set of conductive electrodes being made of germanium;
- a second substrate having a second recess and a second set of conductive electrodes, the second set of conductive electrodes being made of aluminum, the second substrate and the MEMS substrate being bonded together by the first set of conductive electrodes and the second set of conductive electrodes, at least one of the second set of conductive electrodes extending into the second recess of the second substrate;
- and
- a conductive via extending through the second substrate, the conductive via electrically coupled to the first set of conductive electrodes and the second set of conductive electrodes, the conductive via being made of polysilicon.
3 more elements
A microelectromechanical systems (MEMS) device, comprising:
- a dielectric layer on a first substrate, the dielectric layer having a top surface opposite the first substrate, the dielectric layer having multiple recesses therein, each of the multiple recesses extending from the top surface of the dielectric layer and having bottom surfaces higher than a topmost surface of the first substrate, each of the bottom surfaces of the multiple recesses being separated from the topmost surface of the first substrate by portions of the dielectric layer;
- a MEMS substrate bonded to the dielectric layer, the MEMS substrate comprising a movable element and a static element;
- a first set of conductive electrodes over the MEMS substrate, first set of conductive electrodes being made of germanium;
- a second substrate having a recess and a second set of conductive electrodes, the second set of conductive electrodes being made of an aluminum copper alloy, the second substrate and the MEMS substrate being bonded together by the first set of conductive electrodes and the second set of conductive electrodes;
- and
- a conductive via extending through the second substrate, the conductive via electrically coupled to the first set of conductive electrodes and the second set of conductive electrodes, the conductive via being made of polysilicon.
3 more elements
A microelectromechanical systems (MEMS) device, comprising:
- a dielectric layer on a first substrate, the dielectric layer having a top surface facing away from the first substrate, the dielectric layer having multiple recesses extending from the top surface of the dielectric layer, a first recess being one of the multiple recesses, bottom surfaces of each of the multiple recesses being separated from a top surface of the first substrate by portions of the dielectric layer;
- a MEMS substrate bonded to the dielectric layer, the MEMS substrate comprising a movable element and a static element, the movable element being aligned with the first recess;
- a first set of conductive electrodes over the MEMS substrate, the first set of conductive electrodes contacting the MEMS substrate;
- an oxide layer on a second substrate, the second substrate having a second recess, the oxide layer being in the second recess, the second recess being aligned with the movable element;
- a second set of conductive electrodes on the oxide layer of the second substrate, the second set of conductive electrodes being bonded to the first set of conductive electrodes;
- a polysilicon material extending from the second set of conductive electrodes through the second substrate, the oxide layer extending through the second substrate along sidewalls of the polysilicon material;
- and
- a chamber surrounding the movable element, the chamber being between the first substrate and the second substrate and including the first recess and the second recess.
5 more elements
Dependencies are inferred from the claim text.