Micro-electromechanical device having a soft magnetic material electrolessly deposited on a metal layer

A micro-electromechanical device, comprising:

• a wafer substrate;
• a first support structure having a first profile formed on an upper surface of the wafer substrate and a second support structure having a second profile formed on the upper surface of the wafer substrate, the second support structure spaced a distance apart from the first support structure;
• a metal beam attached to the first support structure at a first end and attached to the second support structure at a second end, the metal beam suspended above the upper surface of the wafer substrate, wherein the metal beam is made of a metal that is non-reactive to electroless deposition;
• a layer of palladium coating top, bottom and sides of a middle portion of the metal of the metal beam located between the first and second support structures, wherein the palladium is reactive to electroless deposition;
• and
• a soft magnetic material coating top, bottom and sides of the layer of the palladium located at the middle portion so as to completely encapsulate both the middle portion of metal beam and the layer of palladium located at the middle portion, wherein the soft magnetic material includes a cobalt alloy,
• wherein a space between the suspended metal beam and the upper surface of the wafer substrate directly exposes a bottom portion of the soft magnetic material coating that completely covers the bottom of the metal beam, and
• wherein a first portion of the soft magnetic material coats the layer of palladium at the first end of metal beam, and a second portion of the soft magnetic material that coats the layer of palladium at the second end of the metal beam.