Manufacturing method for electronic component including electrode formed by removal of insulating layer by laser light

A manufacturing method for a discrete electronic component, comprising:

• forming an insulating layer on an outer electrode body of the discrete electronic component so as to cover the outer electrode body, the outer electrode body being formed on a single chip element which constitutes the discrete electronic component;
• and
• removing the insulating layer located in a predetermined region of the outer electrode body of the discrete electronic component so as to expose the predetermined region by applying laser light to the insulating layer in the predetermined region, the insulating layer having a higher absorption coefficient for the laser light than that of a material constituting a surface of the outer electrode body, wherein
• the predetermined region of the outer electrode body is a region of the outer electrode body having the insulating material removed and where the outer electrode body of the discrete electronic component is configured to be bonded to a mounting subject directly or via a plated layer.